Kiln supplies such as sintering boxes and crucibles
Alumina laser-cut substrate
An alumina laser-cut substrate is a circuit board made from alumina ceramic as the raw material and shaped and processed using laser-cutting technology.
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Product Details
An alumina laser-cut substrate is a circuit board made from alumina ceramic as the raw material and shaped and processed using laser-cutting technology.
1. Product Advantages
· High thermal conductivity: Ceramic substrates have a significantly higher thermal conductivity than traditional plastic substrates, enabling rapid heat dissipation and ensuring stable operation of devices under high power conditions.
· Excellent electrical insulation: Ceramics are naturally excellent insulators, effectively isolating different potentials within a circuit, preventing short circuits, and ensuring the circuit operates normally.
· High mechanical strength: Ceramic materials are hard and stable, providing robust mechanical support and protection for fragile semiconductor chips.
· Excellent chemical stability: resistant to corrosion and oxidation, capable of withstanding harsh working environments.
2. Physicochemical indicators
| Project | Aluminum oxide | |||||||
| Content | % | 90 | 96 | 99 | 99.3 | 99.6 | 99.9 | |
| Appearance | White | White | Pale yellowish-white | Pale yellowish-white | White | White | ||
| Roughness | micrometer | 0.2~0.5 | 0.2~0.6 | 0.15~0.4 | 0.1~0.3 | 0.1~0.3 | 0.1~0.2 | |
| Density | g/cm3 | ≥3.75 | ≥3.78 | ≥3.8 | ≥3.9 | ≥3.85 | ≥3.9 | |
| Light reflectance | % | ≥98 | 92 | 85 | 90 | 83 | / | |
| Mechanical properties | Flexural strength | MPa | >380 | >380 | >400 | >470 | >470 | >500 |
| Fracture toughness | MPa·m 1/2 | 3 | 3 | 3.2 | 3.2 | 3.2 | 3.2 | |
| Vickers hardness | GPa | 14 | 14 | 15 | 15 | 16 | 16 | |
| Young's modulus | GPa | 330 | 330 | 350 | 350 | 350 | 350 | |
| Thermal performance | Coefficient of thermal expansion | ×10 -6 /k | 7.7 | 7.8 | 7.9 | 7.8 | 7.9 | 7.9 |
| Thermal conductivity | W(m•k) | >22 | >24 | >28 | >27 | >29 | >29 | |
| Specific heat | J(kg/k) | 750 | 750 | 780 | 780 | 780 | 780 | |
| Electrical performance | Dielectric constant | – | 9.4 | 9.4 | 9.8 | 9.8 | 9.8 | 9.8 |
| Dielectric loss | ×10 -4 | ≤3 | ≤3 | ≤3 | ≤2 | ≤2 | ≤2 | |
| Volume resistivity | Ω•cm | ≥1014 | ≥1014 | ≥1015 | ≥1015 | ≥1015 | ≥1016 | |
| Breakdown voltage | KV/mm | ≥15 | ≥15 | ≥15 | ≥15 | ≥15 | ≥15 | |
3. Product Applications
· Power Electronics: IGBT power modules for electric vehicles/high-speed railways, industrial variable-frequency drives, and smart grids.
· LED lighting: from conventional illumination to high-end automotive headlights and outdoor display screens.
· Laser: High-power semiconductor laser.
· Radio Frequency and Microwave: RF power amplifiers for 5G communication base stations, radar, and satellite communications.
· Aerospace and Military: Electronic systems with extremely high requirements for reliability and environmental durability.
· Automotive electronics: engine control units, electric drive systems for new-energy vehicles, and sensor substrates.
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